深圳市东升精密电子有限公司

项目

技术参数

层数Layer

1-30层（1-30 layer）

板材种类Type of dielectric material

FR4

板厚 Board thickness

0.2-5.0mm(8-200mil)

铜厚PTH hole copper thickness

1/2oz-3oz

加工尺寸 Process size

2mm-2m

最小线宽/间距

Line width/Space(min)

0.1mm(4mil)

最小钻孔孔径Min drilling diameter

0.2mm(10mil)

最小冲孔孔径Min Punch diameter

0.9mm(35mil)

公差 Tolerance

钻孔孔位

Hole position

+0.075mm(3mil)

线宽 Line width

+0.05mm(2mil)

孔径

Hole diameter

PTH +0.075mm(3mil)

NPTH+0.05mm(2mil)

外形公差Routing dimension tolerance（edge to edge）

Routing+0.15mm(6mil)

Punching:+0.10(4mil)

翘曲度

Bow & Twist

0.7%-1%

焊盘表面处理

Surface treating

technic of pad

Nickel/Gold plating/Entek/Hot Air Level

绝缘电阻Insulation Resistance

10KΩ-20MΩ

蚀刻公差 Etching Tolerance

+1mil(25um)

测试电压 Testing voltage

300V

开槽 V-cut

拼板尺寸

penal size

110*100mm-660*600mm

板厚

Board thickness

≥0.6mm(24mil)

公差Tolerance

+0.1mm(4mil)

槽宽

Drilled slot

width

≤0.5mm(20mil)

角度 Angle

30°，45°，60°，90°

槽孔公差 Tolerance of drilled slot

（slot size tol≥2W）

PTHL:+0.15mm(6mil)

W:+0.1mm(4mil)

NPTHL:+0.125(5mil)

W:+0.1mm(4mil)

圆形偏差

Registration Tolerance of Front/Back image

0.075mm(4mil)

Multilayer PCB

层间偏差 Tolerance of innerlayer to

innerlayer

4layers：≤0.15mm(6mil)

6layers：≤0.025mm(10mil)

层间对准度 Registration of interlayer to

interlayer

+3mil(76um)

板厚公差 Tolerance of board

thickness

4layers:+0.13mm(5mil)

6layers:+0.15mm(6mil)

特性阻抗

Impedance

60ohm+10%